University of Vigo
Speaker: Vahram Voskerchyan
- Introduction (1hr)
- 2D materials: Types and properties. (2hr)
- Integration of graphene and 2D semiconductors with photonic IC for the realization of on-chip optical sources, modulators and photodetectors using CMOS compatible fabrication process flow. (3 hr)
- Implementation of hybrid 2D/silicon photonics technology for LIDARs. (2hr)
- 2D single photon emitters. (2hr)
Hybrid Integrated Photonics with 2D Materials.
Modern telecom and datacom technologies require the development of energy-efficient, cost-effective and large-scale photonic integrated circuits (IC) to maintain a secure communication and information flow worldwide. In the last decade, silicon photonics has emerged as one of the main technological platforms for dense photonic on-chip integration of different miniaturized optical functionalities. Silicon photonics has advantages of monolithic integration with CMOS electronics and sharing the same fabrication facilities using standard semiconductor processes.
Today, integrated silicon photonics with III-V laser and Ge photodetector can provide a full set of optoelectronic link including sources and modulators on a transmitter side, waveguide and passive components for light routing, and photodetectors on a receiver side. However, it’s already clear that ever-growing demands for larger data capacity, faster data rates, secure information transfer, and energy efficiency of communication channels require searching for novel solutions and hybrid technologies beyond “classical” silicon photonics.
Recently, 2D materials have emerged as a promising candidate for hybrid integration with silicon photonics. Generally, 2D materials offer novel opportunities for next-generation photonic and optoelectronic technologies, such as lasers, modulators and photodetectors and are compatible with the standard semiconductor technology to be integrated with CMOS fab using back-end-of-line processes. 2D materials are scalable and can be grown on a large scale by Chemical Vapor Deposition (CVD), and then transferred on an arbitrary substrate.
Nowadays, 2D materials are considered to provide new functionalities and advanced performances to silicon photonics, such as integrated optical sources, energy-efficient optical modulators and photodetectors, faster operation speed and broadband spectral response. Unlike silicon, they have direct band gaps which make them good candidates for lasing. Moreover, some 2D materials, such as atomically thin semiconductors (i.e. transition metal dichalcogenides, TMDs) and layered insulators (i.e. hexagonal boron nitride, hBN), have been shown to host single-photon emitters (SPEs). The attractiveness of quantum light sources in layered materials stems from their ability to operate at the fundamental limit of few-atom thickness, providing unprecedented proximity to the surface with increased light extraction efficiency, compatibility with silicon platforms. These attributes yield potential to monolithic integration with scalable silicon photonics technology and high-speed optoelectronic systems to the realization of miniaturized quantum-photonic integrated circuits.
The objective of this conference will be to discuss the heterogeneous integration of 2D materials with silicon photonics technology using a CMOS-compatible photonic chip. The target is to explore advanced technological concepts and devices for optical modulation, detection and light manipulation on-chip using hybrid 2D materials silicon photonics integration.
The proposed conference will encompass the investigation and exploration on two-dimensional material design and fabrication of photonic chips During the conference the following topics will be discussed:
- Integration of graphene and 2D semiconductors with photonic IC for the realization of on-chip optical sources, modulators and photodetectors using CMOS compatible fabrication process flow.
- Implementation of hybrid 2D/silicon photonics technology for LIDARs.
- Discussion on 2D single photon emitters.
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